LOCTITE Ablestik QMI529HT Heat Cure Shimming Adhesive Paste 20.5g
MPN: 1388782 Fabricant: Henkel-LOCTITE
ID MFG: 1388782
LOCTITE Ablestik QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices and solder replacement applications.
Produits relatifs
-
LOCTITE Ablestik E3503-1 Heat Cure Non-Shimming Adhesive Paste 10g Syringe
-
Thermally Conductive Epoxy Adhesive Slow Cure, Flowable Dual Syringe 25mL
-
Thermally Conductive Adhesive Output 3874 25ml Syringe
-
LOCTITE 3972 Light Cure Acrylic 25 ml Syringe
-
Threadlocker 277 High Strength Large Threads 50 ml Bottle